Thermal processing of gallium oxide power electronic devices
Project Description
Power electronics is concerned with the regulation and conversion of electric power for such applications as motor drives, electric vehicles, data centers, and the grid. Today, power devices made of silicon are the mainstream but they are approaching fundamental performance limitations, rendering the commercial power systems bulky and inefficient. New generations of power devices based on a new ultrawide-bandgap semiconductor—gallium oxide—are poised to transform future power systems by increasing both the power density and power conversion efficiency at the device level. Ion implantation doping of gallium oxide offers unique opportunities for realizing novel device structures, yet this technique generally requires high-temperature processing to manage the structural quality of the crystal and optimize the electrical properties of the device. The main objective of this project is to develop robust thermal processes pertinent to the design and engineering of ion-implanted gallium oxide devices.
Supervisor
WONG, Man Hoi
Quota
2
Course type
UROP1000
UROP1100
UROP2100
UROP3100
UROP4100
Applicant's Roles
A full experience of this project requires engagement for multiple, consecutive semesters. Responsibilities include:
- Becoming familiar with relevant background knowledge and literature studies;
- Conducting experiments at the Nanosystems Fabrication Facility (NFF) and Materials Characterization and Preparation Facility (MCPF) after completing the required safety and operational trainings;
- Performing measurements and data analyses.
Applicant's Learning Objectives
- Acquire hands-on skills with microelectronic fabrication;
- Experience the depth and breadth of semiconductor device research;
- Appreciate the significance of collaborative research through working with senior students and research personnel.
Complexity of the project
Moderate