Design and Characterization of a Tactile Sensor Array
Project Description
A tactile sensor detects not only “touch” but also the magnitude of the touching force. Its deployment can significantly enhance man-machine interaction, in gaming, health care systems and robotics, etc. Traditional tactile sensors require the integration of two disparate technologies, one for constructing the control electronics and the other for building the sensing devices. Hitherto they have been mostly separately implemented before their integration in a package. This approach results in increased cost and reduced reliability. A new technology for constructing a tactile sensor array is presently proposed, allowing the monolithic integration of the control electronics and the sensing device on the same substrate. This approach allows the construction of tactile sensor system with reduced cost and enhanced reliability.
Supervisor
WONG Man
Quota
3
Course type
UROP1000
UROP1100
UROP2100
UROP3100
UROP3200
UROP4100
Applicant's Roles
Students taking up the project will actively participate in the implementation and testing of such a tactile sensor. The specific tasks are:
1) LabVIEW software and DAQ development for demonstration and application.
2) Digital circuit design for scanning sensor array.
3) Tactile sensor pixel characterization using a probe station.
1) LabVIEW software and DAQ development for demonstration and application.
2) Digital circuit design for scanning sensor array.
3) Tactile sensor pixel characterization using a probe station.
Applicant's Learning Objectives
Students taking up the project will actively participate in the implementation and testing of such a tactile sensor. The skills acquired are
1) Working knowledge of LabVIEW.
2) Digital and analog circuit design.
3) Instrument operation (including probe station, oscilloscope and other signal acquisition equipment) and construction (equipment for applying force and signal acquisition) skill by using 3D printer or other method.
1) Working knowledge of LabVIEW.
2) Digital and analog circuit design.
3) Instrument operation (including probe station, oscilloscope and other signal acquisition equipment) and construction (equipment for applying force and signal acquisition) skill by using 3D printer or other method.
Complexity of the project
Moderate